

- Surface Mount PWBs
- PWBs designed for high density mounting of flat
package ICs, LSIs and chip components on a single side or on both sides, for
more compact, higher performance electronic systems.
- Surface Blind Via Hole PWBs
- Blind vias connect the surface layer
and inner layers without through holes to reduce the number of PWB layers.
Higher density circuit designs can be achieved using a combination of blind
via hole and surface mount technologies.
- Low Dielectric Material PWBs
- PWBs featuring glass-PTFE as low
dielectric material offers signal propagation speeds up to 1.5 times faster
than standard epoxy-glass based PWBs. These boards are used for LSI test
equipment or supercomputer applications.
- High Layer Count Multilayer PWBs
- High layer count PWBs are used
for supercomputer and large-scale mainframe computer systems. Fujitsu's M-780
series mainframe CPU uses this 42-layer PWB.
- Thin Multilayer PWBs
- Thin multilayer PWBs meet the light weight
and small size requirements form many new systems demand. Fujitsu can supply
PWBs as thin as 0.4mm (0.016 inch).
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